INTERCON 2023 – XXX International Conference on Electronics, Electrical Engineering and Computing

Important Dates

Abstract submission

April 24th, 2023

Paper submission

May 29th 2023


July 3rd, 2023


July 10th, 2023

Author registration deadline

July 15, 2022

2023 IEEE INTERCON – Call For Papers (CFP)

INTERCON (IEEE Peru Section conference) is a renowned IEEE international technical conference which has been conducted in the Peru Section, to bring exciting discoveries, knowledge & understanding together. INTERCON 2023 is the XXX version of the conference and has been themed inspired by the IEEE Future Directions platforms. Year 2023’s INTERCON is co-organized by UPC (Universidad de Ciencias Aplicadas) jointly to its IEEE UPC Student Branch. We invite you to submit technical papers for oral presentations. INTERCON 2023 will continue the footsteps of its predecessors, to serve as a great platform for researchers to discuss and explore advanced technologies in advancing humanity.

Papers presenting original and innovation work in, but not limited to, the following tracks are invited for submission:

  • T1. Artificial Intelligence and Machine learning
  • T2. Communications and Networking
  • T3. Power, Energy, and Power Electronics
  • T4. Biomedical Engineering and Healthcare Technologies
  • T5. Robotics, Control, Instrumentation, and Automation
  • T6. Multimedia Signal Processing and Analytics
  • T7. Devices, Circuits, and Materials
  • T8. RF Circuits, Systems, and Antennas
  • T9. Data Science and Computing Technologies
  • T10. Education in Engineering and Technology

Conference Contacts

Advisory Committee

Carlos Silva Cardenas

Ernesto Cuadros Vargas

William Ipanaqué Alama

General ChairCésar A. Beltrán Castañón, (IEEE Peru Section Chair)
General Co-ChairsYván Tupac Valdivia (UCSP, Peru)
Finance ChairJimmy Túllume Salazar (IEEE Peru Section)
Technical Program Co-ChairJosé Durán Talledo (IEEE Peru Section)
Publication ChairPedro Shiguihara (USIL, Peru)
Industry Co-Chairs

Ricardo Arias (IEEE Peru Section)

Pablo Diaz Reyes (IEEE Peru Section)

Local Co-ChairCarlos Raymundo (UPC, Peru) 
Publicity Co-ChairsFerdinand Pineda (UNAP, Peru) 
Conference ContactLuis Velasquez Rojas ( IEEE Peru Section)


Technical and Financial
Sponsored by:
IEEE Perú Section
Venue:Universidad Peruana de Ciencias Aplicadas
Address:Monterrico Campus, Prolongación Primavera 2390, Surco

Submissions must be written in English. All papers must be submitted through the Easychair submission system in PDF only,  up to 6-page paper (including   based on IEEE conference template. You can also download the templates from here:

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements.

Please submit your work in PDF format via EasyChair: